As reported byDigitimes, makers of Flexible Printed Circuit Boards in Taiwan are happy because the 2009 smartphone market is really heating up with new models coming from HTC, RIM, Apple and you guessed it – Palm. Taiwanese sources said that Chi Mei Communication Systems will be manufacturing the Palm Pre:

Taiwan-based Chi Mei Communication Systems will undertake OEM production of the Palm Pre, Palm’s next-generation smartphone that will be launched soon. Chi Mei is likely to source handset FPCBs from fellow suppliers, including Career Technology, Ichia Technologies and Flexium Interconnect, with shipments expected to begin in March at the earliest, indicated the sources.

In 2005, CMCS joined Foxconn in order to strengthen R&D capacity. Foxconn’s website seems to be nothing but a couple rotating images which, while pointless, are decidedly cuter than the CMCS website.

By the way, if anyone was getting excited about the “shipments expected to begin in March,” don’t get your hopes up. You need to focus on the “at the earliest” part.